An electrolytic processing apparatus according to an embodiment of the
present invention includes: a substrate holder for holding a substrate; a
first electrode to make contact with the substrate for passing
electricity to a processing surface of the substrate; an electrode head
including a high resistance structure and a second electrode, disposed
opposite to and in this order from the substrate holder, and a polishing
surface facing the processing surface of the substrate held by the
substrate holder; an electrolytic solution injection portion for
injecting an electrolytic solution between the processing surface of the
substrate held by the substrate holder and the second electrode; a
relative movement mechanism for moving the substrate holder and the
electrode head relative to each other; a press mechanism for pressing the
polishing surface of the electrode head against the substrate held by the
substrate holder; and a power source for applying a voltage between the
first electrode and the second electrode. The power source is capable of
selectively switching the direction of electric current.