A sensor system includes a thin-film sensor provided with at least one
contact area on the surface thereof, and a printed circuit board provided
with at least one contact pad on the surface thereof. The thin-film
sensor is arranged in relation to the surface of the printed circuit
board such that the surface of the thin-film sensor opposes the surface
of the printed circuit board. In order to transmit sensor currents from
the thin-film sensor to the printed circuit board, a conductive glue
adheres to both the contact area of the thin-film sensor and to the
contact pad on the surface of the printed circuit board.