The present invention comprises a method of sequential unique marking comprising providing a multi-die handling device with a plurality of semiconductor devices therein, reading an ID code on the multi-die handling device, retrieving a tray map file corresponding to the ID code, determining a tray matrix of the multi-die handling device, retrieving data from the tray map file, the data comprising unique characters correlating to each semiconductor device of the plurality of semiconductor devices, and marking each semiconductor device with the data.