An isolated semiconductor wafer platen is disclosed for use in high
pressure processing. The use of vacuum chucking for holding a
semiconductor wafer during processing is well known in the art and can be
applied to high pressure systems as well, but some difficulties can arise
under high pressure processes. Small deflections in even very thick metal
support platens can lead to backside wafer wear, platen abrasion, and
even breakage of semiconductor wafers. This invention discloses a method
to eliminate the transfer of flexure inherent in high pressure vessel
walls, yet still retain the vacuum chucking method.