A communication radio-frequency module is provided that has a
semiconductor device to which an antenna element is connected. This
communication radio-frequency module includes: a supporting body that has
a waveguide formed therein; a wiring board that is fixed onto a surface
of the supporting body; the semiconductor device that is flip-chip
mounted onto the wiring board by ultrasonic bonding; and the antenna
element that is disposed on the other surface of the supporting body. In
this module, the wiring board includes a board core member that is made
of a resin material, and the supporting body includes a supporting body
core member that is also made of a resin material.