A chip with increased impact resistance, attractive design and reduced
cost, and a manufacturing method thereof are provided. A semiconductor
integrated circuit is formed on a large glass substrate, and a part of
data of a ROM included therein is determined by an ink jet method or a
laser cutting method. Accordingly, the cost can be reduced without
requiring a photomask, resulting in an inexpensive ID chip. Further,
depending on the application, the semiconductor integrated circuit is
transposed to a flexible substrate, thereby an ID chip with improved
impact resistance and more attractive design can be achieved.