An analysis method of designing transmission lines of an integrated
circuit packaging board including an integrated circuit chip, a printed
circuit board, and an interposer disposed between the integrated circuit
chip and the printed circuit board. A reference data file having
information for dividing a series of transmission lines into connecting
sections and/or continuous sections and a division model file having
information on analysis models of a connecting section and a continuous
section is prepared. The connecting sections are extracted from the
series of transmission lines with reference to connection information.
Boundaries for dividing the series of transmission lines into sections is
determined with reference to the reference data file to generate division
models. The division models are synthesized to form a synthesized model
of the series of transmission lines to analyze electrical characteristics
of the series of transmission lines.