An apparatus and method for enhancing thermal performance and electromagnetic interference (EMI) shielding in die-up array integrated circuit (IC) device packages is presented. A die-up array package includes an IC die mounted to a first stiffener surface. The package further includes a cap body having first and second surfaces. A first portion of the second surface has a cavity formed therein, and a planar second portion of the second surface is coupled to the first stiffener surface. The package further includes a substrate having a first surface coupled to a second stiffener surface. A plurality of contact pads on the first substrate surface are electrically connected to an array of electrically conductive terminals on a second substrate surface. The stiffener and cap body form a die enclosure that dissipates heat during operation of the IC die, and shields EMI emanating from and radiating toward the IC die.