A thermal contact arrangement. The thermal contact arrangement may
mitigate or reduce migration over time of a thermal interface material
positioned between a chip and a heat sink. The thermal contact
arrangement may include a first zone formed on a first area of the heat
sink and a second zone formed on a second area of the heat sink. The
processor may overlap or overlie the first zone, with the second zone
generally outside the footprint of the processor and optionally
surrounding the processor's footprint. The first zone may have a
generally smooth surface, while the second zone may have a surface
rougher than the first zone. The first zone may be finished to a specific
smoothness while the second zone may be finished to second particular
smoothness that is generally less than the first zone.