A substrate support assembly and method for controlling the temperature of
a substrate within a process chamber are provided. A substrate support
assembly includes an thermally conductive body comprising a stainless
steel material, a substrate support surface on the surface of the
thermally conductive body and adapted to support a large area substrate
thereon, one or more heating elements embedded within the thermally
conductive body, a cooling plate positioned below the thermally
conductive body, a base support structure comprising a stainless steel
material, positioned below the cooling plate and adapted to structurally
support the thermally conductive body, and one or more cooling channels
adapted to be supported by the base support structure and positioned
between the cooling plate and the base support structure. A process
chamber comprising the substrate support assembly of the invention is
also provided.