A thin multichip module comprises: a foldable frame comprising two rigid,
substantially planar members capable of being folded together about a
selected fold axis to form a substantially closed structure; a flex
circuit having a plurality of integrated circuit chips disposed thereon,
the flex circuit bonded to at least one of the planar members over at
least a portion of each of their respective surfaces; and, electrodes on
the module configured to be accessible to an external socket after the
frame is closed. A method for making a thin multichip module comprises
the steps of: a. attaching integrated circuit chips to a flex circuit; b.
bonding the flex circuit to a foldable frame comprising two rigid,
substantially planar members capable of being folded together about a
selected fold axis to form a substantially closed structure; and, c.
folding the frame approximately 180.degree. about the fold axis.