In the upper enclosure, a CPU for application and a memory for application as well as an application device are mounted. In the lower enclosure, a CPU for communication and a memory for communication as well as a transmission/reception circuit are mounted. In such a configuration, the data transfer for application processing is executed mainly in the upper enclosure. Thus, the quantity of data passing through the folding portion from/to the lower enclosure for the application processing is reduced. The wire harness is simplified and power consumption is reduced.