An integrated circuit programmable structure (60) is formed for use a trim resistor and/or a programmable fuse. The programmable structure comprises placing heating elements (70) in close proximity to the programmable structure (60) to heat the programmable structure (60) during programming.

 
Web www.patentalert.com

< Process for ultra-thin body SOI devices that incorporate EPI silicon tips and article made thereby

> Method for forming multi-layer bumps on a substrate

~ 00461