Methods for fabricating a flash memory device are provided. A method comprises forming a plurality of gate stacks overlying a substrate. Each gate stack comprises a charge trapping layer and a control gate. The control gate is a first distance from the substrate. Adjacent gate stacks are a second distance apart. A cell spacer material layer is deposited and is etched to form a spacer about sidewalls of each gate stack. A source/drain impurity doped region is formed adjacent a first gate stack and a last gate stack. The first distance and the second distance are such that, when a voltage is applied to a gate stack during a READ operation, a fringing field is created between the control gate of the gate stack and the substrate and is sufficient to invert a portion of the substrate between the gate stack and an adjacent gate stack.