A heat dissipation module for removing heat from a heat-generating electronic component includes a base (106) and a clip (40, 40a). The clip includes a connecting arm (42, 42a) and a securing arm (44, 44a) for locking the base to the heat-generating electronic component. The connecting arm engages with the base. The securing arm extends from the contacting arm and is curve-shaped with a free end thereof being for being depressed whereby the securing arm exerts a downward force on the base so that the base and the electronic component can have an intimate contact with each other.