An adhesive attachment is provided for securely mounting an attachment component such as a threaded stud or the like on the surface of a selected substrate, wherein the adhesive attachment provides an electrically conductive ground path for grounding the attachment component and/or a selected structure mounted thereto to the substrate. In one preferred form, the attachment component is a threaded element such as a stud or nut. Upon mounting of the attachment component on the substrate and subsequent connection of the threaded element to a mating threaded member, e.g., of the selected structure to be mounted onto the attachment component, a conductive ground pin is pressed into electrical contact with the substrate for grounding the attachment component and/or the selected structure mounted thereto.