An extendable heat dissipation apparatus includes a base, an extendable heat dissipation member and a connecting element. A normal fin is formed on the base, and the connecting element integrates the extendable heat dissipation member in the apparatus with the base. The extendable heat dissipation member can be extendable to an extending location and can also be stored in a storing location with respect to the base.

 
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< Heat sink with built-in heat pipes for semiconductor packages

> Thermal switch, methods of use and manufacturing methods for same

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