Methods are provided for electrochemically depositing copper on a work piece. One method includes the step of depositing overlying the work piece a barrier layer having a surface and subjecting the barrier layer surface to a surface treatment adapted to facilitate deposition of copper on the barrier layer. Copper then is electrochemically deposited overlying the barrier layer.

 
Web www.patentalert.com

< Film-type solid polymer ionomer sensor and sensor cell

> Selectively accelerated plating of metal features

~ 00451