An insulating substrate includes a first area where a semiconductor device
is disposed, a second area where a wiring electrically connecting to the
semiconductor device is disposed, and a third area where a terminal
electrically connecting to the wiring is disposed. A first wiring is
disposed on a main surface of the insulating substrate in the second area
and connects to the second wiring disposed in the first area and the
terminal disposed in the third area through first and second interlayer
connecting portions. With this configuration, the second wiring need not
be disposed in the second area, so that flexibility in the second area
used as a connecting portion increases.