An interposer to be interposed between a semiconductor chip to be mounted
thereon and a packaging board has an interposer portion made of a
semiconductor material and an interposer portion provided around the
foregoing interposer portion integrally therewith. On both surfaces of
the interposer portions, wiring patterns are formed via insulating
layers. The wiring patterns are electrically connected via through holes
formed at required positions in the interposer portions. The outer
interposer portion is made of an insulator or a metal body. Further,
external connection terminals are bonded to one surface of the
interposer.