Disclosed is a key sheet efficiently diffusing local heat generated by a device mounted on a board. A base sheet of a key sheet is provided with a heat diffusion sheet. The heat diffusion sheet is provided with a graphite sheet and a resin film and, in some cases, a thin metal plate. The base sheet itself thus constitutes the heat diffusion sheet, so even if no member for heat diffusion is provided between a board and the key sheet, it is possible to diffuse local heat generated by a semiconductor device in the face direction of the base sheet. Thus, with the key sheet, it is possible to meet the requirement for heat diffusion to eliminate local heat storage in electronic apparatuses and to meet the requirement for a reduction in the thickness and further in weight of electronic apparatuses.

 
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> Rapid conductive cooling using a secondary process plane

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