A wiring board includes: an insulating base; a plurality of conductive wirings; and bumps formed on the conductive wirings, respectively. The conductive wirings can be connected with electrode pads of a semiconductor element via the bumps. The conductive wirings include a connection terminal portion at an end portion opposite to the other end portion where the bumps are formed, and at the connection terminal portion, the conductive wirings can be connected with an external component. The conductive wirings include first conductive wirings and second conductive wirings, on which the bumps are formed respectively at a semiconductor element mounting region. The first conductive wirings extend from the bumps to the connection terminal portion. The second conductive wirings extend beyond the semiconductor element mounting region from the bumps but do not reach the connection terminal portion. End portions of the second conductive wirings extending beyond the semiconductor element mounting region are separated electrically from the first conductive wirings by a cutting portion formed at a boundary region with the first conductive wirings. Irrespective of the state of operating electrode pads of a semiconductor element to be mounted, the bumps can be arranged at constant intervals.