A bond coat system for silicon based substrates wherein a compliant layer having an elastic modulus of between 30 and 130 GPa is provided between the silicon based substrate and a silicon metal containing oxygen gettering layer.

 
Web www.patentalert.com

< Transparent conductive layer forming method, transparent conductive layer formed by the method, and material comprising the layer

> Siloxane-based resin containing germanium and an interlayer insulating film for a semiconductor device using the same
~ 00434