Thinning and stacking are essential for circuit modules used for mobile
devices of various kinds, smart cards, memory cards and the like. These
demands make the manufacture of the circuit modules more complicated or
less reliable due to delamination. A circuit module of a multilayer
structure is provided which is formed by embedding semiconductor chips
and passive components in a sheet made from a thermoplastic resin;
folding a module sheet, which is formed of circuit blocks provided with
wiring patterns thereon, at the boundaries of the circuit blocks so as to
be stacked into layers; and thermal-bonding and integrating the module
sheet by applying heat and pressure. As a result, a highly reliable
circuit module can be manufactured in a simple manner.