Heating devices are formed of a conductive loaded resin-based material.
The conductive loaded resin-based material comprises micron conductive
powder(s), conductive fiber(s), or a combination of conductive powder and
conductive fibers in a base resin host. The ratio of the weight of the
conductive powder(s), conductive fiber(s), or a combination of conductive
powder and conductive fibers to the weight of the base resin host is
between about 0.20 and 0.40. The micron conductive powders are formed
from non-metals, such as carbon, graphite, that may also be metallic
plated, or the like, or from metals such as stainless steel, nickel,
copper, silver, that may also be metallic plated, or the like, or from a
combination of non-metal, plated, or in combination with, metal powders.
The micron conductor fibers preferably are of nickel plated carbon fiber,
stainless steel fiber, copper fiber, silver fiber, or the like.