An embodiment of the present invention is an interconnect technique. A nanostructure bump is formed on a die. The nanostructure bump has a template defining nano-sized openings and metallic nano-wires extending from the nano-sized openings. The die is attached to a substrate via the nanostructure bump.

 
Web www.patentalert.com

< Electronic device, magnetoresistance effect element; magnetic head, recording/reproducing apparatus, memory element and manufacturing method for electronic device

> Self-assembly of peptide-amphiphile nanofibers under physiological conditions

~ 00431