The present invention is directed to structures having a plurality of
discrete insulated elongated electrical conductors projecting from a
support surface which are useful as probes for testing of electrical
interconnections to electronic devices, such as integrated circuit
devices and other electronic components and particularly for testing of
integrated circuit devices with rigid interconnection pads and multi-chip
module packages with high density interconnection pads and the apparatus
for use thereof and to methods of fabrication thereof. Coaxial probe
structures are fabricated by the methods described providing a high
density coaxial probe.