Expansion-adapted mounting and electrical contacting of laser diode elements are connected with one another in terms of structural engineering such that the laser diode elements can be stacked or arranged laterally in one plane for producing vertical diode laser arrangements with low production complexity. The upper and the lower layers of a heat-distributing multilayer substrate for a diode laser subelement, between which a separating layer is disposed, contain metal strata regions arranged spaced from one another of which for forming strata region pairs each strata region of the upper layer is joined electrically conducting to a strata region of the lower layer. The separating layer contains at least one electrically insulating stratum made of non-metallic material and the sum of the thicknesses of metallic strata in the multilayer substrate exceeds the sum of the thicknesses of non-metallic strata at least in a partial region perpendicular to the mounting surface for at least one laser diode element.