The invention is directed to a method for laminating a suspended particle device (SPD) film which comprises forming a suspended particle device film; positioning the suspended particle device film within an unlaminated stack of components for forming a laminated suspended particle device film, wherein the stack comprises at least one hot melt adhesive sheet or film contacting an outer surface of the suspended particle device film; subjecting the unlaminated stack to at least a partial vacuum, preheating the unlaminated stack of components under the vacuum for a time and at a temperature selected to permit at least partial degassing of the stack and applying a sufficient net pressure to the stack at a sufficient temperature and for a sufficient time to produce a laminated suspended particle device film from the unlaminated stack.