The invention presents a novel polyimide-based thin film self-assembly
technology, including five process steps described as follows: (1)
deposits a sacrificial layer and a low-stress microstructure layer on a
silicon substrate; (2) patterns and etches the low-stress microstructure
layer to provide a stationary part and a movable part of the
microstructure; (3) coats a photosensitive polyimide thin film as elastic
joint of the microstructure layer and defines the shape by using
photolithography technique; (4) releases the sacrificial layer beneath
the movable part of microstructure layer by wet etching; (5) lastly
proceeds the reflow process of polyimide to result in the contraction of
the elastic joint further to rotate and lift the movable part in
completion of the self-assembly of the microstructure. As the invention
can be extensively applied to a myriad of miniaturizing industries, it
can solve all the drawbacks of the prior art manufacturing process and
miniaturization.