This invention relates to a method for thermally developing a
photosensitive element to form a relief pattern. The method includes
heating a composition layer of the element to cause a portion of the
layer to liquefy and providing a development medium under tension to the
element to absorb the liquefied composition. The development medium
includes an absorbent material and a support, the combination of which
minimizes stretch and distortion of the absorbent material and can impede
the migration of the liquefied composition through the absorbent
material.