This invention relates to a method for thermally developing a photosensitive element to form a relief pattern. The method includes heating a composition layer of the element to cause a portion of the layer to liquefy and providing a development medium under tension to the element to absorb the liquefied composition. The development medium includes an absorbent material and a support, the combination of which minimizes stretch and distortion of the absorbent material and can impede the migration of the liquefied composition through the absorbent material.

 
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