An apparatus for improved grounding and heat transfer between flange mount
field effect transistors and printed wiring boards is provided comprising
a cut-out formed in the printed wiring board, extending between its top
and bottom surfaces, defining an edge which is covered or plated with a
conductive material at least in some areas. One or more vias also extend
between the top and bottom surfaces of the cut-out and are exposed along
the edge. A field effect transistor is placed in the cut-out and into
contact with a heat sink element designed to enhance grounding of the
field effect transistor and improve the transfer of heat to the chassis
or other metal support structure for the printed wiring board.