An apparatus for cooling at least one heated surface includes a base plate
defining a number of inlet and outlet manifolds. The inlet manifolds are
configured to receive a coolant, and the outlet manifolds exhaust the
coolant. The inlet and outlet manifolds are interleaved. The apparatus
also includes at least one substrate having inner and outer surfaces. The
inner surface is coupled to the base plate and defines a number of
microchannels that receive the coolant from the inlet manifolds and
deliver the coolant to the outlet manifolds. The microchannels are
oriented substantially perpendicular to the inlet and outlet manifolds.
The outer surface is in thermal contact with the heated surface. The
apparatus also includes an inlet plenum that supplies the coolant to the
inlet manifolds, and an outlet plenum that exhausts the coolant from the
outlet manifolds. The inlet plenum and outlet plenum are oriented in a
plane of the base plate.