An electrolytic liquid is used for electrolytic polishing which can
provide a processed surface having high flattening characteristics with a
low voltage applied while ensuring a higher processing rate for an
conductive material, and can remove an unnecessary conductive material
and expose a barrier film without causing dishing, erosion, or etching at
the interface between the barrier film and a metal (conductive material).
The electrolytic liquid for use in electrolytic polishing of a surface
conductive material of a workpiece comprises an aqueous solution
containing at least one organic acid or its salt, at least one strong
acid having a sulfonic acid group, a corrosion inhibitor and a
water-soluble polymeric compound.