The present invention provides an improved packaging structure of a memory card, such as mini SD memory card. The packaging structure comprises a substrate having a plurality of integrated circuit devices and passive devices located therein, and a metal cover having an insulating layer formed on a top portion of the metal cover. A plurality of protruding plates bending downward are formed around a circumferential area of the metal cover, and a roll-shaped fixing part is formed at a bottom portion of a particular protruding plate. The roll-shaped fixing part and the protruding plates are utilized to engage the frame with the metal cover to form a sealed structure so that the frame covers all the protruding plates and the roller-shaped fixing part of the metal cover. The integrated circuit devices and the passive devices are located within the space of the frame to form a mini SD memory card package.