A semiconductor wafer is provided with a wiring structure, and
semiconductor chip positions arranged in rows and columns. The
semiconductor wafer has at least one coating (6) as a self-supporting
dimensionally stable substrate layer (4), and/or as a wiring structure
composed of conductive, high-temperature-resistant material. The coating
material (6) of the substrate layer (4) and/or of the wiring structure
has a ternary carbide and/or a ternary nitride and/or carbon.