A method and incorporated heat sink that is cooled both thorough air flow and liquid circulation is provided. The heat sink is disposed close to electronic components and used for their cooling. It comprises a finned structure positioned such that air can easily pass though it; a heat source plate disposed thermally in direction of heat flow to one side of the finned structure such that the heat source plate is in thermal communication with the finned structure fin base and fin tips, and a second plate also disposed at an opposing end of the finned structure in thermal communication both with finned structure fin base and fin tips. The heat sink also includes fluid re-circulator disposed at least partially in the plates for circulating fluids though the plates and around said finned structure such that both fin tips and fin base is cooled.