.[.The invention includes methods for forming integrated circuits within
substrates, and embedded circuits. In one aspect, the invention includes
a method of forming an integrated circuit within a substrate comprising:
a) providing a recess in a substrate; b) printing an antenna within the
recess; and c) providing an integrated circuit chip and a battery in
electrical connection with the antenna. In another aspect, the invention
includes a method of forming an integrated circuit within a substrate
comprising: a) providing a substrate having a first recess and a second
recess formed therein; b) printing a conductive film between the first
and second recesses and within the first and second recesses, the
conductive film forming electrical interconnects between and within the
first and second recesses; c) providing a first electrical component
within the first recess and in electrical connection with the electrical
interconnets therein; d) providing a second electrical component within
the second recess and in electrical connection with the electrical
interconnects therein; and e) covering the first electrical component,
the second electrical component and the conductive film with at least one
protective cover. In another aspect, the invention includes an embedded
circuit comprising: a) a substrate having a recess therein, the recess
having a bottom surface and a sidewall surface joined to the bottom
surface; b) interconnect circuitry formed on the bottom and sidewall
surfaces; and c) an integrated circuit chip within the recess and
operatively connected to the interconnect circuitry..]..Iadd.Method of
forming a radio frequency identification (RFID) device. In one
embodiment, a recess is provided in a plastic substrate containing an
integrated circuit comprising RFID circuitry. A conductive material
extends over a sidewall of the recess and is coupled to the integrated
circuit in a first region and to an antenna in a second region. A
flexible film may be disposed over the recess, the integrated circuit,
and the conductive material..Iaddend.