Blister packages are provided which are formed from multilayered films having a lid-stock film which is heat sealed directly to a fluoropolymer film. A polymeric base layer is adhered to a fluoropolymer layer via a first intermediate adhesive tie layer; a support layer is adhered to the fluoropolymer layer via a second intermediate adhesive tie layer; and a metallic foil layer is adhered to the support layer via a third intermediate adhesive tie layer. The blister has a greatly improved moisture barrier over blister packages of the prior art.