A chip components feeding apparatus is provided to be able to lessen a push load applied to a leading electronic part from succeeding electronic chip component to favorably take out the leading electronic part even in the case where a residual pressure phenomenon occurs in a conveyance passage. Since a chip component conveyance tube is provided with an ascending portion, in which an air flow based on an action of negative pressure causes electronic chip component to move climbing against dead weight, it is possible to restrict a pushing force applied to electronic chip component forwardly from those electronic chip component in the ascending portion, which are acted by dead weight, to lessen a push load applied to a leading electronic part by succeeding electronic chip component even in the case where a residual pressure phenomenon occurs in a conveyance passage including a chip component conveyance tube when the action of negative pressure is released.

 
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< Air heating apparatus

> Method of fabricating an electrode structure for use in an integrated circuit

~ 00413