The radiation-sensitive negative-type resist composition for pattern
formation containing an epoxy resin, a radiation-sensitive cationic
polymerization initiator, and a solvent for dissolving the epoxy resin
therein, characterized in that the resist composition, through drying,
forms a resist film having a softening point falling within range of 30
to 120 C and that the epoxy resin is represented by formula (1): (wherein
R1 represents a moiety derived from an organic compound having k active
hydrogen atoms (k represents an integer of 1 to 100); each of n.sub.1,
n.sub.2, through n.sub.k represents 0 or an integer of 1 to 100; the sum
of n.sub.1, n.sub.2, through n.sub.K falls within a range of 1 to 100;
and each of "A"s, which may be identical to or different from each other,
represents an oxycyclohexane skeleton represented by formula (2):
(wherein X represents any of groups represented by formulas (3) to (5):
and at least two groups represented by formula (3) are contained in one
molecule of the epoxy resin)) ##STR00001##