A semiconductor module according to the invention includes: an island formed of a conductive material; a plurality of leads disposed in vicinity of the island; a resin sealing body which is mounted on the island and disposed such that a back surface of a circuit board on which semiconductor elements is exposed upward; a sensor which is mounted on the back surface of the circuit board; and a thin metallic wire which electrically connects the circuit board with the leads. The island, the resin sealing body, the sensor, and parts of the leads are sealed by a second sealing resin.