The invention provides a forming process of a thin film pattern capable of properly realizing a thin line. The forming process of a thin film pattern of the invention can be a process of forming a thin film pattern by arranging a functional liquid on a substrate P. The process can include a bank forming step to set up banks protrudingly on the substrate corresponding to the thin film pattern, a repellent liquefaction step of imparting a liquid repellent property to the bank by CF.sub.4 plasma processing, and a material arranging step of arranging the functional liquid between the banks imparted with the liquid repellent property.