A modular heat sink and semiconductor chip assembly includes a
semiconductor chip, a base plate disposed in a heat conducting
relationship with the semiconductor chip and containing a plurality of
slots extending through the base plate, a plurality of fins individually
passed through a number of the plurality of slots and containing
voltage-less input/output connections to facilitate grounding with the
chip, and at least one electrical component passed through one of the
plurality of slots and containing a high-density input/output structure
on one edge and is electrically connected to the semiconductor chip.