A modular heat sink and semiconductor chip assembly includes a semiconductor chip, a base plate disposed in a heat conducting relationship with the semiconductor chip and containing a plurality of slots extending through the base plate, a plurality of fins individually passed through a number of the plurality of slots and containing voltage-less input/output connections to facilitate grounding with the chip, and at least one electrical component passed through one of the plurality of slots and containing a high-density input/output structure on one edge and is electrically connected to the semiconductor chip.

 
Web www.patentalert.com

< Interface module-mounted LSI package

> Fixed pillar with heat loss

~ 00409