A multi-part lead frame semiconductor device assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame semiconductor device assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi-part lead frame may be dissimilar.

 
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< Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs

> Semiconductor device including a plurality of circuit element chips and a manufacturing method thereof

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