A curable formaldehyde-free binding composition for use with fiberglass is provided. Such curable composition comprises a substantially unpolymerized acrylate and/or methacrylate primarily having no more than approximately six recurring moieties. The composition is either unpolymerized at the time of its application to the fiberglass or in the form of an oligomer. The curable composition is coated on fiberglass and thereafter is cured to form a secure binder. In a preferred embodiment the fiberglass is the form of building insulation. In other embodiments the product is a microglass-based substrate useful for as a printed circuit board, battery separator, filter stock, or reinforcement scrim.