The invention relates to an electronic component with a housing package
comprising a number of layers of plastic with at least one buried
interconnect layer and with at least one semiconductor chip, which has
pointed-conical external contacts distributed on an outer side. The
pointed-conical external contacts penetrate through one of the layers of
plastic and form contact vias with respect to the buried interconnect
layer. Furthermore, the invention relates to a method for producing such
an electronic component.