Methods and apparatus are provided for removing plating from a device. The
method and apparatus may be used for preparing an electrical connector
for connecting at least one wire or other terminus thereto where the
electrical connector has at least one electrical contact with a metal
coating thereon. The method includes the steps of applying molten solder
to the electrical contact whereby the coating dissolves into the molten
solder to thereby create a molten coating-solder mixture and rotating the
electrical connector whereby the molten coating-solder mixture is removed
from the electrical contact.