There is provided a heat transferring object for transferring heat generated by a object to be cooled to a cooling unit, having a plurality of thermal transferring plates each having elasticity and provided in lamination and adhesive materials having thermal conductivity and provided between the thermal transferring plates so as to slidably hold the thermal transferring plates. Preferably, each of the thermal transferring plates has almost the same shape. Each of the thermal transferring plates may have a cooling unit fixing portion to be secured to the cooling unit and a plurality of extensions extending respectively from the cooling unit fixing portion and secured to the objects to be cooled independently from each other.

 
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> Cross-flow redundant air cooling method for high reliability electronics

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