An aqueous acidic plating bath for the electrodeposition of a nickel or nickel alloy deposit. The bath includes nickel ions and an additive having the general formula: H.sub.2C.dbd.CHCH.sub.2NR.sub.1R.sub.2 or [H.sub.2C.dbd.CHCH.sub.2N.sup.+R.sub.1R.sub.2R.sub.3].sub.nX.sup.n- wherein R.sub.1, R.sub.2 and R.sub.3 are selected from the functional groups consisting of hydrogen, methyl, ethyl, propyl, allyl, propyn, propanediol and combinations thereof; and X.sup.n- is an n-valent inorganic or organic anion.